Temperature Solder Paste affects the soldering quality of the product but also directly relates to the reliability and service life of the equipment, ensuring that solder joints can still maintain good electrical and mechanical properties in a high-temperature environment. During the soldering process of electronic components on the circuit board of miner strictly controlled. High-temp solder paste is suitable for high-temp reflow soldering processes, more suitable for soldering delicate components such as ASIC chips, because it can provide enough heat for soldering without damaging the chips.
The solder joints of low-temp solder may fall off when subjected to vibration due to insufficient firmness, soldering some small electronic components with low heat resistance, low-temp solder may be a suitable choice. Which is one of the reasons why some people think that low-temperature solder may lead to repeated repairs after maintenance, provides better soldering quality and stability.
Soldering Effects Of Various Temperatures
It is applicable to the high-temperature reflow soldering process, ensuring that the solder joints can still maintain good electrical and mechanical properties in a high-temp environment. This enables the medium-temp solder to form stable and reliable solder joints during the soldering process, improving the reliability and service life of the product. The low-temp solder still has wide application value in situations where it is necessary to protect the welded components from high-temperature damage. The alloy composition is mainly the Sn-Bi series, among which Sn42Bi58 is a eutectic alloy. Solder bars are formed by adding elements such as bismuth, indium, and cadmium to the solder alloy.
Temperature Solder Paste is suitable for components that cannot withstand high-temp soldering stability, due to its excellent properties such as high temperature resistance and oxidation resistance and do not change during the assembly of minier circuit boards and can withstand relatively high temp and pressures.
